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اللغة العربيةNingbo Oriental Mecha & Elec
UST300A Scanning Acoustic Microscopy(SAM)
Scanning Acoustic Microscope is developed for inspection of the internal defect location, size and distribution in the semiconductor packages or materials using high frequency ultrasonic waves. It is very sensitive to bonding layer, so it can discover air holes, flaws, impurities and delaminations, etc.
Scanning Acoustic Microscope is a kind of non-destructive device which can display waveforms and high resolution images of the inner of inspected objects, and can reserve small defects lost in destructive inspection.
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Product Information
Scanning Acoustic Microscope is developed for inspection of the internal defect location, size and distribution in the semiconductor packages or materials using high frequency ultrasonic waves. It is very sensitive to bonding layer, so it can discover air holes, flaws, impurities and delaminations, etc. Scanning Acoustic Microscope is a kind of non-destructive device which can display waveforms and high resolution images of the inner of inspected objects, and can reserve small defects lost in destructive inspection. The inspected objects can be used unceasingly. UST300 Scanning Acoustic Microscope is mainly applied in the field of failure analysis, reliability analysis, process control, quality control, product development, process improvement, etc.
Key Features
Main Features
Smartscan Powerful SAM software –Smartscan, Chinese and English interface, lifetime free software upgrades.
Scanning axis is made of linear motor, closed-loop control, high speed and precision, low noise.
Separating type ultrasonic transmitting and receiving system, equipped with signal pre-amplification device, low, high-pass filter, to ensure good signal quality.
Wide variety of transducers, frequency range from 5MHz to 300MHz.
Inspect mode: A, B, C, Body, Trassmission, Multi-layer, Offline scan,JEDEC tray scan,etc.
Defect size and area statistics, automatic calculation of the percentage of defects in the measurement area.
C Scan image peak, positive and negative peak image, phase reversal image and pseudo color images in real time to switch, easy to analyze the device defects from different angles.
Multiple detection results windows can display at the same time, and can be reanalyzed;
Test Items
Detection Modes: A-scan, B-scan, C-scan, Multi-layer Scan (M-scan), Slice Scan (S-scan), Surface Scan (S-scan), Bulk Scan (BK-scan), Loss of Echo Scan (LE-scan), Full Data Acquisition Scan (FC-scan), Tray Scan, Contour Scan, etc.
Automatic Defect Coloring: The software is equipped with phase judgment function to mark defects with colors. It supports multiple coloring schemes and allows user-defined configuration.
Automatic Defect Analysis Function: It enables automatic defect identification, statistics of defect size and area, and automatic calculation of the percentage of defective area in the measured area.
Technical Data
Ultrasonic transmitter receiver bandwidth ： 5-300MHz(500MHz option)
Ultrasonic transducer frequency range ： 5MHz-300MHz
A/D acquisition card frequency：1GSample/s
The max resolution of scan shaft: 0.5µm
Maximum scanning speed：1000 mm/s
Repeatability：±1µm
Z Focus axis travel：100mm
Maximum scanning range X/Y:
320mm X 320mm(Standard Machine)
320mm X 160mm (Through Scan Option)
SMTest Test Software
Detection Modes: A-scan, B-scan, C-scan, Multi-layer Scan (M-scan), Slice Scan (S-scan), Surface Scan (S-scan), Bulk Scan (BK-scan), Loss of Echo Scan (LE-scan), Full Data Acquisition Scan (FC-scan), Tray Scan, Contour Scan, etc.
² Automatic Defect Coloring: The software is equipped with phase judgment function to mark defects with colors. It supports multiple coloring schemes and allows user-defined configuration.
² Automatic Defect Analysis Function: It enables automatic defect identification, statistics of defect size and area, and automatic calculation of the percentage of defective area in the measured area.
